XTPL will deliver a Delta Printing System (DPS) together with a dedicated laser system for laser sintering of printed copper paths to a new industrial partner in Japan. The customer operates in the field of advanced automated industrial machinery for the global electronics and semiconductor technology sectors.
The DPS order follows a successful technology validation process carried out jointly by the customer and XTPL in Wrocław. It marks the transition of the project to the third stage of XTPL’s industrial implementation process, during which the customer will begin independently validating the company’s technology in its own research and development laboratory.
This is another XTPL product sale to Japan. The solution will be tested in yield management processes for advanced structures used in semiconductor advanced packaging applications, where copper is used as a conductive material.
Delivery of the DPS device and the laser system is planned for the second half of 2026. The sale is supported by XTPL’s local distributor in Japan, PEC – Printed Electronics Corporation.
“We are pleased with another sale in the demanding Japanese market, especially as this order comes from a new customer and concerns a completely separate project from the UPD module sale reported in June,” says Filip Granek, CEO of XTPL S.A.
“In this case, the customer decided to purchase a DPS device, enabling independent validation of XTPL’s technology in its own research and development laboratory. In our terminology, this means that a project with industrial implementation potential has moved to the third stage of the process, following completed validation tests conducted jointly by the customer and our laboratory in Wrocław.”
“We therefore see a very important sign that our commercial model is replicable. A second independent partner in Japan is developing a project in the same strategic application area: yield management for HDI/UHDI PCBs and semiconductor substrates used in advanced packaging, with the use of our copper nanopaste. Japan remains one of the most technologically advanced industrial markets in the world, which makes further engagement from a customer in this country particularly important for building XTPL’s global brand.”
DPS System for Independent Technology Validation
The order covers the Delta Printing System, which serves as a laboratory demonstrator of XTPL’s UPD technology and a tool for its independent validation by the partner. It will be supplied together with a dedicated laser system enabling the laser sintering of printed copper paths.
The customer will use the solution in yield management processes aimed at improving manufacturing yields for advanced structures used in semiconductor advanced packaging.
The project has now entered the third of five stages in XTPL’s industrial implementation process.
The first stage includes initial contact and defining the scope for potential cooperation. The second stage involves technology evaluation carried out jointly by the customer and XTPL’s laboratory in Wrocław. The third stage begins when the customer purchases a DPS device in order to independently validate the technology in its own R&D laboratory.
If the results are positive, the next stage involves ordering a UPD module and integrating it into the customer’s prototype industrial machine. This allows final testing to be conducted on a pilot industrial line before a decision is made on the full industrial implementation of XTPL’s technology.
The customer is a Japanese manufacturer of advanced automated industrial machinery for the global electronics and semiconductor sectors. It has several decades of experience in designing and supplying such solutions to markets around the world.
“The sale of the DPS system together with the dedicated laser solution shows that the customer is making a capital commitment to further, independent validation of XTPL’s technology after several months of research cooperation with our laboratory in Wrocław,” says Jacek Olszański, Chief Financial Officer and Member of the Management Board of XTPL S.A.
“Formally, the project is at an earlier stage than the first UPD module sale to Japan reported in June. However, its importance for our pipeline is substantial, as it expands our portfolio of advanced industrial projects in the strategic yield management area for advanced semiconductor packaging structures.”
“Delivery of the device and revenue recognition are planned for the second half of 2026, while the customer is expected to begin its independent work this year. In the case of full industrial implementation, the project has significantly greater potential than the implementation we have been carrying out in China since January 2025.”
Two Independent Projects in Japan
The Japanese order strengthens XTPL’s most promising application area outside the flat-panel display segment and confirms growing interest in the company’s technology in semiconductor and advanced packaging applications.
In June 2026, XTPL announced its first UPD module sale to Japan. That project is already at the fourth stage of the industrial implementation process, where XTPL’s UPD module is being integrated into the customer’s prototype industrial machine.
This means XTPL is now developing two independent projects in Japan in closely related application areas, although at different stages of the path toward further industrial implementation of its technology.
